Summit High Accuracy Dimensional Metrology System
Product Overview
The OGP Summit high accuracy dimensional metrology system is designed for components requiring a large work envelope and high accuracy. With the same core technologies used in OGP Pinnacle measurement systems, the Summit features a fixed bridge design which offers larger measuring envelope. Separate X and Y axis motion systems ensure that neither influences the mechanical integrity of the other, while also enabling easy loading and unloading of large parts.
This metrology system is ideal for measurement of large footprint parts such as:
- PCBs
- Stencils
- Flat panel displays
- Etching sheets and mark patterns
- Nested groups of smaller parts
Our precision measurement experts have experience working with high accuracy dimensional metrology systems in a range of settings with a large variety of parts. Schedule a one-on-one demonstration to see how the Summit can increase efficiency in your operation.
As a distributor for OGP, Cross offers the Summit High Accuracy Dimensional Metrology System throughout our sales territories in the U.S. Our technical sales team offers local one-on-one customized product demonstrations which help determine your specific needs and ensure you have the best solution for your operation. For more information about the OGP products we offer, to set up a local demonstration, or to get a quote for new equipment, fill out our form to discuss your needs with a Cross team member today!
